High-End Electronic Chemical | ODPA (CAS 1823-59-2) – Core Monomer for Polyimide, Leading Innovation in Advanced Materials

In high-end manufacturing sectors including 5G communications, flexible displays, new energy vehicles and aerospace, high-performance polyimide (PI) materials have become indispensable key substrates. As a core aromatic dianhydride monomer for PI synthesis, 4,4'-Oxydiphthalic Anhydride (ODPA, CAS 1823-59-2) has emerged as a "core raw material" driving industrial upgrading, thanks to its unique ether bond structure and excellent comprehensive performance.

I. Core Product Information

Chinese Name: 4,4'-Oxydiphthalic Anhydride (Alias: Diphenyl Ether Dianhydride, ODPA)

CAS No.: 1823-59-2

Molecular Formula: C16H6O7

Molecular Weight: 310.21

Appearance: Off-white crystalline powder

Purity: ≥99.5% (electronic grade, customizable to 99.8% high-purity grade)

Melting Point: 225–229℃

Packaging: 25kg/damp-proof fiber drum, sealed and stored away from light

II. Outstanding Performance Creates High-End Value

ODPA features a symmetric structure combining flexible ether bonds and rigid aromatic rings, with high reactivity and thermal stability, delivering four core advantages to downstream PI materials:

1.Ultra-high heat resistance: PI film glass transition temperature Tg＞350℃, long-term resistance to 250℃high-temperature environments.

2.Low dielectric constant & low loss: Dielectric constant Dk＜3.0@10GHz, suitable for 5G high-frequency and high-speed communication scenarios.

3.High toughness & high strength: Tensile strength＞200MPa, balanced flexibility and mechanical strength, ideal for folding, bending and other dynamic applications.

4.Low moisture absorption & high transparency: Water absorption rate＜0.5%, high visible light transmittance, meeting requirements for flexible displays and optical films.

III. Full-Scenario Applications Covering High-Growth Sectors

As a core raw material for high-performance polymers, ODPA is widely used in high-growth fields:

5G High-Frequency Copper Clad Laminates: Base materials for high-speed PCBs and FPCs, ensuring low-loss transmission of high-frequency signals.

OLED Flexible Displays: Flexible substrates and PI films for foldable screens, enabling lightweight and high-reliability products.

New Energy Batteries: Electrode binders and separator coatings, improving high-temperature resistance and cycle stability.

Aerospace: Lightweight composite materials and high-temperature resistant insulation parts for extreme working conditions.

Advanced Electronic Packaging: Curing agent for high-end epoxy resins and modifier for polyether ketone (PEK).

IV. Market Trend: Accelerated Domestic Substitution, Short Supply of High-Purity Products

Benefiting from the deepening of 5G construction, the boom of new energy vehicles and mass production of flexible screens, the global ODPA market continues to expand. China’s annual production capacity reached 8,000 tons in 2025, and high-purity electronic-grade products (≥99.5%) are in short supply. Leading domestic enterprises have broken through foreign technical barriers and achieved large-scale production of high-purity ODPA, with products certified by top PI manufacturers. Costs are reduced by 30% compared with imported products, marking a fast track for domestic substitution.

V. Our Strengths

Quality Assurance: Electronic-grade high-purity products (99.5%–99.8%), single metal ion ＜ 1ppm, compliant with high-end electronic material standards.

Stable Supply: Large-scale production lines with sufficient stock, supporting small-batch sampling and large-volume customization.

Technical Support: Professional team providing one-stop technical services including formula optimization and process adaptation.

ODPA – the "heart" of high-end PI materials, empowering industrial innovation in 5G, new energy, flexible displays and more, helping advance domestic high-end materials and create a valuable future together!