Latent Epoxy Curing Accelerator｜CAS 10097‑09‑3 (4,4'‑Methylenebis(1,1‑dimethyl‑3‑phenylurea))

Aug 14, 2026｜Fine‑Chemical Industry News
Recently, 4,4'‑Methylenebis(1,1‑dimethyl‑3‑phenylurea) (CAS: 10097‑09‑3, trade name: MDU‑11), a high‑performance latent substituted urea curing accelerator, has achieved large‑scale application in powder coatings, structural adhesives, prepregs and electronic encapsulation fields. It effectively addresses the long‑standing industry bottleneck of high curing temperature and the trade‑off between storage life and curing efficiency within dicyandiamide‑epoxy systems.
This product features an aromatic bis‑substituted urea structure. It appears as an off‑white solid powder, with molecular formula C₁₉H₂₄N₄O₂ and molecular weight 340.42. It is specially developed for one‑component dicyandiamide (DICY)‑epoxy resin systems. Exhibiting high chemical inertness at ambient temperature, it enables formulations with over 6‑month room‑temperature storage stability. Upon thermal activation, it delivers rapid catalytic action, markedly lowering curing temperature and shortening curing cycles. Cured end‑products possess elevated glass‑transition temperature (Tg), outstanding bonding strength and superior humidity‑heat resistance.
Key Application Scenarios
*Epoxy powder coatings: Fusion‑bonded epoxy (FBE) powder for pipeline anti‑corrosion and metal component powder coatings; reduces baking temperature and improves overall coating properties.
*One‑component structural adhesives & adhesive films: Bonding of electronic components, automotive structural adhesives; no on‑site mixing required for easy processing, with excellent peel resistance.
*Composite prepregs: Glass‑fiber and carbon‑fiber epoxy prepregs for aerospace and rail‑transport composite parts; balances shelf‑life and hot‑press forming efficiency.
*Electronic encapsulation & underfill materials: Epoxy encapsulants for semiconductor devices; improves curing uniformity and enhances heat‑resistance and insulating performance.
Usage Reference: Typical loading: 1‑5 phr in dicyandiamide‑epoxy systems. Full curing is accomplished within several minutes at 150 °C, and within one hour at 100 °C.
Compared with monophenyl dimethyl urea analogues, the bis‑urea structure of 10097‑09‑3 provides superior thermal stability, extended shelf‑life, low tendency for high‑temperature blooming, and enhanced heat resistance of finished articles. It is a preferred accelerator grade for high‑end one‑component epoxy formulations. Industry insiders state that driven by industrial upgrading of domestic high‑end powder coatings, electronic adhesives and advanced composite materials, market demand for domestic latent epoxy additives keeps rising. This substituted‑urea product will continuously replace imported grades and support independent controllability of the new‑material industrial chain.
Safety Notice: For industrial‑additive use only; not for food or pharmaceutical applications. Wear dust‑proof protective equipment during handling; store in sealed and light‑proof conditions.