Bis-epoxy High-Activity Modifying Monomer｜N-(2-Methylphenyl)-N-(1,2-epoxypropyl)-oxiranemethanamine Empowering Epoxy Adhesives, High-End Coatings and Fine Synthesis

Driven by continuous upgrading of precision electronic bonding, heavy-duty anti-corrosion coatings, high-end modified epoxy resins and fine organic synthesis industries, conventional epoxy monomers generally suffer from high viscosity, insufficient cross-link density, poor humidity-heat resistance, high brittleness upon curing and weak compatibility, which severely hinder performance iteration of high-end formulations. To meet urgent market demands, our company has realized stable high-purity mass production of N-(2-Methylphenyl)-N-(1,2-epoxypropyl)-oxiranylmethylamine (CAS: 40027-50-7), a core functional monomer for high-performance epoxy modification, catalytic curing and fine synthesis.

This product is an aromatic bis-epoxy tertiary amine compound. Its molecule features both rigid methylphenyl backbone and two highly reactive epoxy functional groups, delivering outstanding reactivity, system compatibility, thermal stability and chemical resistance. It is efficiently applicable to epoxy resin modification, curing acceleration, cross-linking toughening and synthesis of high-end intermediates, serving as a key raw material for high-end adhesives, insulating coatings, anti-corrosion materials and fine synthesis.

Key Product Specifications

Chemical Name: N-(2-Methylphenyl)-N-(1,2-epoxypropyl)-oxiranylmethylamine English Name: N-(2-Methylphenyl)-N-(oxiran-2-ylmethyl)oxiran-2-methanamine CAS No.: 40027-50-7 Appearance: Pale yellow transparent oily liquid Purity: ≥98% Features: Low viscosity, high reactivity, high cross-link density, high-temperature resistance, humidity-heat resistance, broad formulation compatibility

Core Product Advantages

1. High-activity bis-epoxy structure with strong cross-linking capacity 

The molecule contains two epoxy reactive sites with high reactivity. It rapidly participates in resin cross-linking and curing, greatly increasing system cross-link density and rendering cured articles denser with improved solvent resistance, acid-alkali resistance and anti-permeation performance.

2.Aromatic rigid backbone for superior heat and weathering resistance 

Incorporated o-methylphenyl rigid structure substantially improves thermal stability, anti-yellowing property and mechanical strength of cured systems compared with aliphatic monomers. Cured parts resist softening, cracking and failure under high-temperature service conditions.

3.Low viscosity for easy processing and broad formulation compatibility

 Moderate viscosity and good flow behavior. Excellent compatibility with various epoxy resins, diluents, additives and fillers without delamination or precipitation. Suitable for low-temperature curing and fast forming processes.

4.Combined toughening and reinforcing effect to mitigate brittleness

Rigid backbone together with flexible epoxy side-chain structure effectively addresses drawbacks of conventional cured epoxies such as high hardness-brittleness tendency, easy cracking and poor impact resistance, achieving simultaneous improvement in strength and toughness.

Core Application Fields

1.High-End Epoxy Adhesives 

Used for modification of electronic structural adhesives, precision bonding adhesives and potting compounds to enhance bonding strength, heat resistance, insulation property and humidity-heat aging resistance.

2.Industrial Heavy-Duty Anti-Corrosion & Insulating Coatings 

Applied in high-end epoxy anti-corrosion topcoats, equipment insulating coatings and chemical-resistant coatings to improve coating compactness, salt-spray performance and resistance against solvent erosion.

3.Synthesis of Modified Epoxy Resins

As a functional comonomer for manufacturing special epoxy resins with superior heat resistance, weathering resistance and high cross-link density. Suitable for composites, high-end flooring and military-supporting materials.

4.Intermediate for Fine Organic Synthesis

Leveraging its highly reactive bis-epoxy structure for synthesis of custom fine chemicals, functional additives, special curing agents and high-end pharmaceutical / material intermediates.

Product Value & Supply Strengths

This product effectively resolves typical drawbacks of conventional epoxy systems such as slow curing, low heat resistance, high brittleness, inferior corrosion resistance and poor storage stability. It is a preferred functional monomer for high-end modification of epoxy materials. We now provide stable small-batch supply. Sample testing and formulation technical consultation are available to help downstream customers achieve product upgrading, cost reduction & efficiency improvement, and import substitution.